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PMEG60T20ELXD-QX - Nexperia

Description: plastic surface-mounted package with solderable lead ends; 2.2 mm x 1.3 mm x 0.68 mm body

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PMEG60T20ELXD-QX - Nexperia - PCB symbol
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PMEG60T20ELXD-QX - Nexperia PCB footprint - Other - Other - DO-219AD
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PMEG60T20ELXD-QX - Nexperia - 3D model - Other - DO-219AD
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PMEG60T20ELXD-QX Details

  • Manufacturer Part Number:

    PMEG60T20ELXD-QX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-323HP, 2 PIN

  • Manufacturer Package Code:

    SOD323HP

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Additional Feature:

    FREE WHEELING DIODE, LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Breakdown Voltage-Min:

    60 V

  • Case Connection:

    CATHODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.7 V

  • JESD-30 Code:

    R-PDSO-F2

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    35 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.65 W

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Rep Pk Reverse Voltage-Max:

    60 V

  • Reverse Current-Max:

    0.47 µA

  • Reverse Recovery Time-Max:

    0.0045 µs

  • Reverse Test Voltage:

    60 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

PMEG60T20ELXD-QX Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a solid copper plane on the bottom layer, connected to the thermal pad of the PMEG60T20ELXD-QX, to ensure efficient heat dissipation. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation in high-temperature environments, Nexperia recommends derating the device's power dissipation according to the temperature derating curve provided in the datasheet. Additionally, ensure proper thermal design and heat sinking to keep the junction temperature below the maximum rating.
  • Nexperia recommends using a low-ESR ceramic capacitor (X5R or X7R dielectric) with a value of 4.7uF to 10uF for the input capacitor. This ensures stable operation and minimizes voltage ripple.
  • To prevent EOS damage, Nexperia recommends following proper handling and assembly procedures, such as using anti-static wrist straps, mats, and packaging materials. Additionally, ensure that the device is not exposed to excessive voltage or current during testing or operation.
  • Nexperia recommends a soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 30-60 seconds. Ensure that the soldering process is within the specified temperature range to prevent damage to the device.

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PMEG60T20ELXD-QX Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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