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PMF170XP,115 - Nexperia

Description: Trench MOSFET P-channel 20V 1A SOT323

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Symbol
PMF170XP,115 - Nexperia - PCB symbol
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PCB Footprints
PMF170XP,115 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-70 (SOT323)
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3D Models
PMF170XP,115 - Nexperia - 3D model - SOT23 (3-Pin) - SC-70 (SOT323)
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PMF170XP,115 Details

  • Manufacturer Part Number:

    PMF170XP,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70

  • Package Description:

    SC-70, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.9

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    1 A

  • Drain-source On Resistance-Max:

    0.3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMF170XP,115 Frequently Asked Questions (FAQs)

  • Nexperia recommends a PCB layout with a large copper area connected to the tab of the PMF170XP,115 to ensure good thermal conduction. A minimum of 2 oz copper thickness is recommended, and the copper area should be connected to a solid ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it is essential to follow Nexperia's recommended thermal design guidelines, including using a heat sink, ensuring good airflow, and avoiding thermal hotspots. Additionally, the device should be operated within its specified temperature range, and the junction temperature should be monitored to prevent overheating.
  • Exceeding the maximum junction temperature of 150°C can lead to a reduction in the device's lifespan, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device operates within its specified temperature range to prevent premature aging or failure.
  • To protect the PMF170XP,115 from electrical overstress (EOS), it is essential to follow proper handling and assembly procedures, including using electrostatic discharge (ESD) protection, avoiding excessive voltage or current, and ensuring that the device is operated within its specified ratings.
  • Nexperia recommends storing the PMF170XP,115 in its original packaging, away from direct sunlight, moisture, and extreme temperatures. The device should be handled with care to prevent mechanical stress, and electrostatic discharge (ESD) protection should be used during handling and assembly.

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PMF170XP,115 Overview

Use the download button to access the PMF170XP,115 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PMF17, or try a keyword search, such as Small Signal Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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