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PMN30XPX - Nexperia

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PMN30XPX - Nexperia  - 3D model
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PMN30XPX Details

  • Manufacturer Part Number:

    PMN30XPX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOP

  • Package Description:

    SC-74, SOT-457, TSOP-6

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT457

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    5.2 A

  • Drain-source On Resistance-Max:

    0.034 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    125 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    6.25 W

  • Pulsed Drain Current-Max (IDM):

    21 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMN30XPX Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for PMN30XPX is -55°C to 150°C.
  • To ensure reliability, follow Nexperia's recommended assembly and soldering guidelines, and ensure proper thermal management and PCB design.
  • Yes, PMN30XPX is AEC-Q101 qualified, making it suitable for automotive applications.
  • Use a thermal pad on the PCB, and ensure good thermal conductivity between the device and the PCB. A minimum of 2 oz copper thickness is recommended.
  • Use a heat sink or thermal interface material to improve heat dissipation. Ensure good airflow and consider using a fan or other cooling mechanisms if necessary.

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PMN30XPX Overview

Use the download button to access the PMN30XPX 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PMN30, or try a keyword search, such as Power Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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