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PMP5501Y,115 - Nexperia

Description: Bipolar (BJT) Transistor Array 2 PNP (Dual) Matched Pair 45V 100mA 175MHz 300mW Surface Mount 6-TSSOP

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PCB Footprints
PMP5501Y,115 - Nexperia PCB footprint - Other - Other - TSSOP6 (SOT363)_2025-1.1
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3D Models
PMP5501Y,115 - Nexperia  - 3D model - Other - TSSOP6 (SOT363)_2025-1.1
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PMP5501Y,115 Details

  • Manufacturer Part Number:

    PMP5501Y,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-88, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    45 V

  • Configuration:

    SEPARATE, 2 ELEMENTS

  • DC Current Gain-Min (hFE):

    200

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    PNP

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    175 MHz

PMP5501Y,115 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the component away from heat sources and ensure good airflow.
  • Use a heat sink, ensure good airflow, and consider derating the device's power handling capabilities according to the temperature derating curve in the datasheet.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially catastrophic failure. Ensure proper thermal management to avoid this.
  • Yes, but ensure the device is properly sealed and conformal coated to prevent moisture ingress. Follow IPC-J-STD-001 guidelines for moisture-sensitive devices.
  • Use a systematic approach: check the power supply, input/output connections, and PCB layout. Consult the datasheet, application notes, and Nexperia's support resources for guidance.

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PMP5501Y,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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