PMR100HZPJU5L0 footprint, schematic symbol and 3D model by ROHM Semiconductor

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PMR100HZPJU5L0 Details

ROHM recommends a land pattern with a pad size of 2.5mm x 1.6mm, and a spacing of 0.5mm between pads. Refer to ROHM's recommended land pattern document for more details.
To ensure reliable operation, maintain a maximum junction temperature (Tj) of 125°C. Use a thermal pad or heat sink to dissipate heat, and follow ROHM's thermal design guidelines.
ROHM recommends a soldering profile with a peak temperature of 260°C, and a dwell time of 10-30 seconds. Refer to ROHM's soldering guidelines for more information.
Yes, the PMR100HZPJU5L0 is designed to withstand vibrations up to 10G (10Hz-2kHz). However, it's essential to follow ROHM's vibration testing guidelines and ensure proper mounting and soldering.
To ensure reliability, follow ROHM's moisture sensitivity level (MSL) guidelines, and store the devices in a dry environment. If exposure to high humidity is unavoidable, use conformal coating or other protection methods.

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