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PMR100HZPJV1L0 - ROHM Semiconductor

Description: 6432(2512)Size, Ultra-low Ohmic Chip Resistors For Current Detection (AEC-Q200 Qualified)

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PMR100HZPJV1L0 - ROHM Semiconductor  - 3D model
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PMR100HZPJV1L0 Details

  • Manufacturer Part Number:

    PMR100HZPJV1L0

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Height:

    0.52 mm

  • Package Length:

    6.4 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    3 W

  • Rated Temperature:

    70 °C

  • Resistance:

    0.001 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL PLATE

  • Temperature Coefficient:

    150 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

PMR100HZPJV1L0 Frequently Asked Questions (FAQs)

  • ROHM recommends a land pattern with a minimum pad size of 1.2mm x 0.8mm and a solder mask opening of 0.8mm x 0.5mm to ensure reliable soldering and minimize thermal resistance.
  • While PMR100HZPJV1L0 is rated for operation up to 150°C, it's essential to consider the derating curve and ensure the device doesn't exceed the maximum allowed power dissipation at the desired operating temperature.
  • To prevent moisture-related issues, follow ROHM's recommended storage and handling procedures, and consider applying a conformal coating or potting compound to protect the device from humidity.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 4°C/s to minimize thermal stress and ensure reliable solder joints.
  • While PMR100HZPJV1L0 is designed to withstand moderate vibrations, it's crucial to consider the device's mechanical stress limits and ensure proper mounting and fixation to prevent damage or malfunction.

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PMR100HZPJV1L0 Overview

Use the download button to access the PMR100HZPJV1L0 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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