PMR10EZPFU10L0 footprint, schematic symbol and 3D model by ROHM Semiconductor

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PMR10EZPFU10L0 Details

The recommended land pattern for PMR10EZPFU10L0 is a rectangle with a size of 2.5mm x 1.3mm, with a thermal pad size of 1.5mm x 1.3mm. The land pattern should be designed to ensure good thermal conductivity and mechanical stability.
To ensure the reliability of the PMR10EZPFU10L0 in high-temperature applications, it is recommended to follow the derating curve provided in the datasheet, and to ensure that the device is operated within the recommended operating temperature range of -40°C to 150°C. Additionally, proper thermal management and heat sinking are crucial to prevent overheating.
The maximum allowable power dissipation for the PMR10EZPFU10L0 is 10W. However, this value can vary depending on the operating conditions and the thermal management of the device. It is recommended to follow the power derating curve provided in the datasheet to ensure safe operation.
The PMR10EZPFU10L0 is designed to operate in a normal humidity environment. However, it is not recommended to use the device in high-humidity environments (>80% RH) without proper protection, such as conformal coating or potting, to prevent moisture-related failures.
The recommended storage condition for the PMR10EZPFU10L0 is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. The device should be stored in its original packaging or in a shielded bag to prevent electrostatic discharge (ESD) damage.

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