PMR10EZPJ000 footprint, schematic symbol and 3D model by ROHM Semiconductor

Symbol

PCB Footprints

3D Models

PMR10EZPJ000 Details

The recommended land pattern for PMR10EZPJ000 is a rectangular pad with a size of 2.5mm x 1.5mm, with a solder mask opening of 2.2mm x 1.2mm.
To handle thermal considerations, ensure a good thermal connection to a heat sink or a thermal pad on the PCB. The thermal resistance of the package is 25°C/W, and the maximum junction temperature is 150°C.
The recommended soldering temperature profile for PMR10EZPJ000 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C.
Yes, PMR10EZPJ000 is suitable for use in high-humidity environments, but it's recommended to follow the moisture sensitivity level (MSL) guidelines to prevent damage during assembly.
To ensure reliability, follow the recommended storage and handling guidelines, and perform thorough testing and inspection during the manufacturing process. Additionally, consider using a conformal coating to protect the device from environmental factors.

Manufacturer Collaborated

System Verified

Community Approved

Use the download button to access the PMR10EZPJ000 schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like PMR10, or try a keyword search, such as Fixed Resistors

If you searched for PMR10EZPJ000, you might also be interested in these parts:

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →