PMR18EZPJ000 footprint, schematic symbol and 3D model by ROHM Semiconductor

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PMR18EZPJ000 Details

The recommended land pattern for PMR18EZPJ000 is a rectangular pad with a size of 2.5mm x 1.6mm, with a solder mask opening of 2.2mm x 1.3mm.
To handle thermal considerations, ensure a good thermal connection to a heat sink or a thermal pad on the PCB. The thermal resistance of the package is 25°C/W, and the maximum junction temperature is 150°C.
The recommended soldering profile for PMR18EZPJ000 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
To ensure reliability in high-humidity environments, apply a conformal coating to the PCB, and ensure that the component is stored in a dry environment with a relative humidity of 60% or less.
The PMR18EZPJ000 has an ESD protection of 2kV human body model and 200V machine model, ensuring protection against electrostatic discharge.

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