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PMR18EZPJU9L0 - ROHM Semiconductor

Description: 3216(1206)Size, Ultra-low Ohmic Chip Resistors For Current Detection (AEC-Q200 Qualified)

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PMR18EZPJU9L0 Details

  • Manufacturer Part Number:

    PMR18EZPJU9L0

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.28 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PAPER, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    9e-9 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL PLATE

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn)

  • Terminal Shape:

    ONE SURFACE

  • Tolerance:

    5%

PMR18EZPJU9L0 Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • To ensure reliable operation, follow the recommended derating curves for temperature and power dissipation. Also, consider using a heat sink or thermal interface material to reduce the junction temperature.
  • Although the datasheet doesn't specify a maximum input voltage, it's recommended to limit the input voltage to 5.5V to prevent damage to the internal ESD protection diodes.
  • Yes, the PMR18EZPJU9L0 is suitable for high-frequency switching applications up to 1MHz. However, ensure that the PCB layout is optimized for high-frequency operation, and consider using a snubber circuit to reduce ringing and EMI.
  • The POR and BOR functions are internally implemented, and no external components are required. However, ensure that the power supply ramp-up time is within the recommended specifications to prevent false resets.

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PMR18EZPJU9L0 Overview

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