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PMR50HZPJU5L0 - ROHM Semiconductor

Description: 5025(2010)Size, Ultra-low Ohmic Chip Resistors For Current Detection (AEC-Q200 Qualified)

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PMR50HZPJU5L0 Details

  • Manufacturer Part Number:

    PMR50HZPJU5L0

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    9

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.42 mm

  • Package Length:

    5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Resistance:

    5e-9 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2010

  • Surface Mount:

    YES

  • Technology:

    METAL PLATE

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

PMR50HZPJU5L0 Frequently Asked Questions (FAQs)

  • ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • Implement a heat sink or thermal management system, and ensure the device is operated within the recommended temperature range (−40°C to +150°C).
  • ROHM recommends derating the voltage by 1.5V per 50°C above the maximum operating temperature (150°C) to ensure reliable operation.
  • Yes, the PMR50HZPJU5L0 is suitable for high-frequency switching applications up to 1MHz, but ensure proper PCB layout and decoupling to minimize ringing and EMI.
  • Use a thermal compensation circuit or implement a temperature sensing mechanism to adjust the gate drive voltage accordingly, ensuring optimal performance and minimizing power losses.

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PMR50HZPJU5L0 Overview

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