ROHM recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
To ensure reliable operation at high temperatures, it's essential to follow the recommended derating curves, ensure proper thermal design, and consider the device's power dissipation and junction temperature.
ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a cooling rate of 3-5°C/s to prevent thermal shock and ensure reliable solder joints.
While the PMR50HZPJV3L0 is designed to operate in a wide range of temperatures, it's not recommended for use in high-humidity environments without proper protection. Consider using a moisture-resistant coating or conformal coating to prevent moisture ingress.
ROHM recommends storing the PMR50HZPJV3L0 in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing the device in direct sunlight or near heat sources.
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PMR50HZPJV3L0 Overview
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