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PMSTA06,115 - Nexperia

Description: Bipolar Transistors - BJT PMSTA06/SOT323/SC-70

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PCB Footprints
PMSTA06,115 - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - PMSTA06,115
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3D Models
PMSTA06,115 - Nexperia  - 3D model - SOT23 (3-Pin) - PMSTA06,115
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PMSTA06,115 Details

  • Manufacturer Part Number:

    PMSTA06,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-70

  • Package Description:

    SC-70, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT323

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    1997-09-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    80 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    50

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    100 MHz

PMSTA06,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance by using thermal vias.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves, ensure good thermal design, and consider using a heat sink or thermal interface material to reduce junction temperature.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure the device operates within the recommended temperature range.
  • When selecting a package type, consider factors such as thermal performance, PCB space constraints, and reflow soldering requirements. The PMSTA06,115 is available in a TO-220AB package, which is suitable for most applications.
  • When paralleling multiple devices, ensure that each device has an identical thermal environment, use a common gate drive signal, and consider the current sharing and thermal balancing between devices.

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PMSTA06,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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