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PMV37ENEAR - Nexperia

Description: MOSFET 60V N-CHANNEL

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PCB Footprints
PMV37ENEAR - Nexperia PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - -SOT23 (TO-236AB)
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3D Models
PMV37ENEAR - Nexperia  - 3D model - SOT23 (3-Pin) - -SOT23 (TO-236AB)
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PMV37ENEAR Details

  • Manufacturer Part Number:

    PMV37ENEAR

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-236

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT23

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    15.4 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    3.5 A

  • Drain-source On Resistance-Max:

    0.049 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    30 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    8.3 W

  • Pulsed Drain Current-Max (IDM):

    14 A

  • Reference Standard:

    AEC-Q101; IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMV37ENEAR Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance by using thermal vias.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a suitable heat sink, and ensure good airflow around the device.
  • To prevent damage, handle the device by the body, avoid touching the pins, store the device in an anti-static bag or wrap, and avoid exposing it to moisture, extreme temperatures, or physical stress.
  • To troubleshoot overheating or thermal shutdown issues, check for proper heat sink installation, ensure good airflow, verify the device is operated within the recommended temperature range, and inspect for signs of physical damage or contamination.
  • For soldering and desoldering, use a soldering iron with a temperature range of 200°C to 250°C, avoid applying excessive force or pressure, and use a solder with a melting point above 180°C.

Trust Checks

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PMV37ENEAR Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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