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PMXB120EPEZ - Nexperia

Description: MOSFET 30 V, P-channel Trench MOSFET

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PCB Footprints
PMXB120EPEZ - Nexperia PCB footprint - Other - Other - PMXB120EPEZ-5
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3D Models
PMXB120EPEZ - Nexperia  - 3D model - Other - PMXB120EPEZ-5
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PMXB120EPEZ Details

  • Manufacturer Part Number:

    PMXB120EPEZ

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN1010D-3, SOT-1215, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT1215

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6.9

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    2.4 A

  • Drain-source On Resistance-Max:

    0.12 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    32 pF

  • JESD-30 Code:

    R-PDSO-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.07 W

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMXB120EPEZ Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a large copper area connected to the tab of the PMXB120EPEZ, and to use thermal vias to dissipate heat to the other side of the PCB. Additionally, keeping the component away from other heat sources and using a thermal interface material can help improve thermal performance.
  • To ensure proper soldering, use a soldering iron with a temperature of 250-270°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the time the iron is in contact with the component. Avoid applying excessive force or pressure, which can damage the device.
  • When handling the PMXB120EPEZ, take precautions to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat, and handle the device by the body or pins, avoiding touching the die. Store the device in an anti-static bag or wrap when not in use.
  • The correct gate resistor value depends on the specific application and the required switching frequency. A general guideline is to use a gate resistor value between 10 ohms and 100 ohms. However, it's recommended to consult the application note or contact Nexperia support for specific guidance.
  • Exceeding the maximum junction temperature (Tj) of 150°C can lead to reduced device lifespan, increased thermal resistance, and potentially cause permanent damage to the device. It's essential to ensure the device operates within the recommended temperature range to maintain reliability and performance.

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PMXB120EPEZ Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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