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PMZ290UNE2YL - Nexperia

Description: NEXPERIA - PMZ290UNE2YL - MOSFET, N-CH, 20V, 1.2A, SOT883-3

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PMZ290UNE2YL - Nexperia - PCB symbol
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PCB Footprints
PMZ290UNE2YL - Nexperia PCB footprint - Other - Other - PMZ290UNE2YL-3
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PMZ290UNE2YL - Nexperia - 3D model - Other - PMZ290UNE2YL-3
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PMZ290UNE2YL Details

  • Manufacturer Part Number:

    PMZ290UNE2YL

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DFN

  • Package Description:

    DFN1006-3, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    SOT883

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    1.2 A

  • Drain-source On Resistance-Max:

    0.32 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PBCC-N3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PMZ290UNE2YL Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, using a large copper area for heat dissipation, and minimizing thermal resistance by using vias and thermal vias.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, use a suitable heat sink, and implement thermal management techniques such as thermal interface materials and airflow management.
  • Key considerations for EMI and RFI shielding include using a metal shield or a Faraday cage, keeping the device away from high-frequency sources, and using filtering or shielding on the input and output lines.
  • To handle overvoltage protection and surge immunity, use a transient voltage suppressor (TVS) or a metal-oxide varistor (MOV) in parallel with the device, and ensure that the device is operated within the recommended voltage range.
  • Recommended soldering and assembly techniques include using a soldering iron with a temperature range of 250°C to 260°C, applying a soldering flux, and using a reflow oven with a controlled temperature profile.

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PMZ290UNE2YL Overview

Use the download button to access the PMZ290UNE2YL schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PMZ29, or try a keyword search, such as Small Signal Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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