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PN5180A0HN/C1E - NXP

Description: NXP - PN5180A0HN/C1E - RFID, NFC, 13.56MHZ, HVQFN-40

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Symbol
PN5180A0HN/C1E - NXP - PCB symbol
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PCB Footprints
PN5180A0HN/C1E - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT618-1
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3D Models
PN5180A0HN/C1E - NXP - 3D model - Quad Flat No-Lead - SOT618-1
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PN5180A0HN/C1E Details

  • Manufacturer Part Number:

    PN5180A0HN/C1E

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    SOT618-1

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

PN5180A0HN/C1E Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow NXP's application note AN11536 for PCB layout guidelines, and ensure a thermal resistance of <10°C/W for the package. A heat sink or thermal pad can be used to improve thermal management.
  • Antenna tuning is crucial for optimal NFC performance. Follow NXP's application note AN11537 for antenna design and tuning guidelines. Use a network analyzer to measure the antenna's impedance and adjust the tuning components accordingly.
  • Use a 10uF capacitor in parallel with a 100nF capacitor for power supply decoupling. Add a ferrite bead or a pi-filter to reduce noise and EMI. Follow NXP's application note AN11538 for more details.
  • Implement secure firmware updates using NXP's Secure Firmware Update (SFU) protocol. Ensure the security of your NFC application by following NXP's guidelines for secure boot, secure storage, and secure communication protocols.
  • Follow NXP's test and validation guidelines for NFC applications, including testing for NFC Forum compliance, antenna performance, and electromagnetic compatibility (EMC). Use tools like the NXP NFC Reader or the NFC Forum's Certification Test Suite.

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PN5180A0HN/C1E Overview

Use the download button to access the PN5180A0HN/C1E schematic symbol, PCB footprint, and 3D model.
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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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