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PN5180A0HN/C2E - NXP

Description: RF Front End High-performance multi-protocol full NFC Forum-compliant frontend

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PN5180A0HN/C2E - NXP - PCB symbol
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PCB Footprints
PN5180A0HN/C2E - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN-40
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3D Models
PN5180A0HN/C2E - NXP - 3D model - Quad Flat No-Lead - HVQFN-40
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PN5180A0HN/C2E Details

  • Manufacturer Part Number:

    PN5180A0HN/C2E

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    SOT618-1

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

PN5180A0HN/C2E Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate layer for the antenna is recommended. Keep the RF traces as short as possible and avoid vias under the IC. Refer to the NXP application note AN11916 for more details.
  • Ensure proper thermal management by providing adequate heat dissipation through a heat sink or thermal pad. Avoid operating the device in extreme temperatures (below -40°C or above 125°C) and follow the recommended storage conditions.
  • Use a 50-ohm antenna with a suitable radiation pattern. Optimize the antenna design for the target frequency band (e.g., 13.56 MHz for NFC). Perform impedance matching and tuning using a network analyzer or simulation tools to ensure optimal performance.
  • Use the device's built-in power-down modes (e.g., shutdown, hibernate) to minimize power consumption when not in use. Implement a power management strategy that balances power consumption with performance requirements. Refer to the datasheet for specific power-down mode details.
  • Implement a firmware that adheres to the NFC Forum specifications and follows the NXP-provided firmware examples. Ensure proper initialization, configuration, and error handling. Use a suitable software development kit (SDK) and follow the NXP-provided guidelines for firmware development.

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PN5180A0HN/C2E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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