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PN5180A0HN/C3E - NXP

Description: RF Front End High-Performance Multi-protocol Full NFC Forum-compliant Frontend

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PCB Footprints
PN5180A0HN/C3E - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT618-1
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3D Models
PN5180A0HN/C3E - NXP  - 3D model - Quad Flat No-Lead - SOT618-1
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PN5180A0HN/C3E Details

  • Manufacturer Part Number:

    PN5180A0HN/C3E

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-40

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    5

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

PN5180A0HN/C3E Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and design guide in their application note AN11916, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • NXP provides antenna tuning and matching guidelines in their application note AN11917, which includes information on antenna selection, impedance matching, and tuning techniques to optimize the performance of the PN5180A0HN/C3E.
  • The PN5180A0HN/C3E has a maximum junction temperature of 125°C. To prevent overheating, ensure good thermal conductivity between the device and the PCB, use thermal vias, and consider using a heat sink or thermal pad. NXP provides thermal management guidelines in their application note AN11918.
  • NXP provides a firmware development kit (FDK) and a software development kit (SDK) for the PN5180A0HN/C3E, which include tools and documentation for firmware updates, debugging, and development. The FDK and SDK can be downloaded from the NXP website.
  • The PN5180A0HN/C3E supports various security protocols, including AES encryption and secure authentication. NXP provides guidelines for secure data transmission and implementation of security protocols in their application note AN11919.

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PN5180A0HN/C3E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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