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PN7150B0HN/C11002E - NXP

Description: High performance full NFC Forum-compliant controller with integrated firmware and NCI interface

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PN7150B0HN/C11002E - NXP - PCB symbol
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PCB Footprints
PN7150B0HN/C11002E - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT618-1
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3D Models
PN7150B0HN/C11002E - NXP - 3D model - Quad Flat No-Lead - SOT618-1
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PN7150B0HN/C11002E Details

  • Manufacturer Part Number:

    PN7150B0HN/C11002E

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    QFN

  • Package Description:

    HVQFN-40

  • Pin Count:

    40

  • Manufacturer Package Code:

    SOT618-1

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

PN7150B0HN/C11002E Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow the PCB layout guidelines provided in the application note AN11835. Additionally, ensure proper thermal management by providing a heat sink or thermal pad to dissipate heat generated by the device.
  • For optimal antenna design, follow the guidelines provided in the application note AN11835. It's recommended to use a loop antenna with a diameter of 40-50 mm and a wire diameter of 0.5-1 mm. Also, ensure the antenna is placed at a distance of at least 5 mm from the PN7150B0HN/C11002E device.
  • To ensure stable operation, it's recommended to use a decoupling capacitor of 10-100 nF between the VDD and GND pins. Additionally, use a filter capacitor of 10-100 nF between the VDD and AVDD pins to reduce noise and ensure proper operation.
  • To implement secure firmware updates and secure boot mechanisms, use the Secure Firmware Update (SFU) feature provided by NXP. This feature ensures secure authentication and encryption of firmware updates. Additionally, use a secure boot mechanism such as Secure Boot and Chain of Trust to ensure the authenticity and integrity of the firmware.
  • For NFC applications, it's recommended to perform testing and validation using the NFC Forum's Analog Test Suite and Digital Test Suite. Additionally, perform testing for NFC tag emulation, peer-to-peer mode, and card emulation to ensure compliance with NFC specifications.

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PN7150B0HN/C11002E Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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