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PN7150B0HN/C11006Y - NXP

Description: NFC/RFID Tags & Transponders High performance NFC controller, supporting all NFC Forum modes, with integrated firmware and NCI interface.

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PN7150B0HN/C11006Y - NXP - PCB symbol
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PCB Footprints
PN7150B0HN/C11006Y - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - SOT618-1
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3D Models
PN7150B0HN/C11006Y - NXP - 3D model - Quad Flat No-Lead - SOT618-1
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PN7150B0HN/C11006Y Details

  • Manufacturer Part Number:

    PN7150B0HN/C11006Y

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    HVQFN-40

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • JESD-30 Code:

    S-PQCC-N40

  • JESD-609 Code:

    e4

  • Length:

    6 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    40

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -30 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC40,.24SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    1.95 V

  • Supply Voltage-Min:

    1.65 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    6 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

PN7150B0HN/C11006Y Frequently Asked Questions (FAQs)

  • NXP recommends a 4-layer PCB with a solid ground plane, and thermal vias under the IC to dissipate heat. A thermal pad on the bottom of the IC should be connected to a large copper area on the PCB to improve heat dissipation.
  • NXP provides an application note (AN11536) that provides guidelines for antenna design and optimization. It's recommended to use a 50-ohm antenna and follow the design guidelines for optimal performance.
  • NXP recommends using a 10uF capacitor in parallel with a 100nF capacitor for power supply decoupling. Additionally, a pi-filter or a common-mode choke can be used to filter out noise and improve EMI performance.
  • NXP provides a secure boot mechanism using the ROM bootloader. For secure firmware updates, NXP recommends using a secure protocol such as HTTPS or COAP, and implementing secure authentication and encryption mechanisms.
  • The PN7150 has a low power consumption mode, but it's essential to consider the overall system power budget, including the MCU, sensors, and other components. NXP recommends using a power management IC to optimize power consumption and extend battery life.

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PN7150B0HN/C11006Y Overview

Use the download button to access the PN7150B0HN/C11006Y schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PN715, or try a keyword search, such as Other uPs/uCs/Peripheral ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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