CUI Inc recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1W/m-K or higher is suggested between the module and the heat sink.
To ensure reliability and longevity, operate the module within the recommended temperature range (–40°C to +85°C). Implement proper thermal management, and ensure the module is not exposed to moisture, vibration, or physical stress. Regularly inspect the module for signs of wear or damage.
The PRF20-Q110-S12 is designed to meet CISPR 22 Class B emissions standards. To minimize EMI and RFI, use a shielded enclosure, keep the module away from antennas and other EMI-sensitive components, and ensure proper grounding and decoupling of the module's input and output lines.
Yes, the PRF20-Q110-S12 can be used in redundant or parallel configurations to achieve higher power output or redundancy. However, it is essential to ensure proper synchronization and control of the modules to prevent oscillations or instability.
CUI Inc recommends using a π-filter (C-L-C) or a common-mode choke at the input to reduce EMI and noise. At the output, a simple LC filter or a π-filter can be used to reduce ripple and noise. The specific filter design will depend on the application's requirements and noise sensitivity.
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PRF20-Q110-S12 Overview
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