CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, ensure a minimum of 10mm clearance around the module for airflow and heat dissipation.
To ensure EMC, CUI recommends following proper PCB design and layout guidelines, using a metal enclosure, and implementing EMI filtering on the input and output lines. Additionally, the module should be installed in a way that minimizes radiation and conduction of electromagnetic interference.
CUI provides a derating curve in the datasheet, but for more detailed information, please contact CUI's technical support team. They can provide a customized derating curve based on your specific application and environmental conditions.
Yes, the PRMCE1-S15-S15-S can be used in a redundant or parallel configuration, but it's essential to follow CUI's guidelines for synchronization and current sharing. Please consult with CUI's technical support team for more information and recommendations.
CUI provides an MTBF rating of >500,000 hours at 25°C, calculated according to MIL-HDBK-217F. However, please note that actual MTBF may vary depending on the application, environmental conditions, and other factors.
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PRMCE1-S15-S15-S Overview
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