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PS2505L-1-F3-A - Renesas Electronics

Description: Support is limited to customers who have already adopted these products.The PS2505-1, -4 and PS2505L-1, -4 are optically coupled isolators containing GaAs light emitting diodes and an NPN silicon phototransistor. The PS2505-1, -4 are in a plastic DIP (Dual In-line Package) and the PS2505L-1, -4 are lead bending type (Gullwing) for surface mount.

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PS2505L-1-F3-A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 4-SMD_Gull Wing
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PS2505L-1-F3-A Details

  • Manufacturer Part Number:

    PS2505L-1-F3-A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Country Of Origin:

    Japan

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    80%

  • Current Transfer Ratio-Nom:

    300%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.08 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e6

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000003 s

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN BISMUTH

PS2505L-1-F3-A Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended. Ensure a minimum of 1mm clearance around the device for airflow and heat dissipation.
  • Implement proper EMI shielding, use twisted pair cables, and consider adding common-mode chokes or ferrite beads to the signal lines. Also, ensure signal termination and impedance matching.
  • Critical timing parameters include clock frequency, clock-to-output delay, and output enable/disable times. Ensure setup and hold times are met by carefully designing the clock tree, using clock domain crossing techniques, and adding buffers or registers as needed.
  • Follow the recommended power-up and power-down sequences in the datasheet. Ensure a slow and controlled voltage ramp-up (e.g., 10ms) and ramp-down (e.g., 10ms) to prevent damage or latch-up.
  • Follow the recommended PCB layout and shielding guidelines. Ensure proper grounding, decoupling, and filtering. Use EMI filters or common-mode chokes on I/O lines, and consider using a metal shield or enclosure for the device.

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PS2505L-1-F3-A Overview

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