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PS2535L-1-F3-A - Renesas Electronics

Description: The PS2535-1 and PS2535L-1 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon darlington connected phototransistor. A high withstanding voltage between the I/O, the high voltage between the collector and emitter of the transistor, and darlington transistor output enables low-current input. The PS2535-1 is in a plastic DIP (Dual In-line Package) and the PS2535L-1 is lead bending type (Gull-wing) for surface mount.

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PS2535L-1-F3-A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 4-SMD-3
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PS2535L-1-F3-A Details

  • Manufacturer Part Number:

    PS2535L-1-F3-A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    350 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • Current Transfer Ratio-Min:

    400%

  • Current Transfer Ratio-Nom:

    1500%

  • Dark Current-Max:

    400 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e1

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.12 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    DARLINGTON OUTPUT OPTOCOUPLER

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Power Dissipation-Max:

    0.2 W

  • Response Time-Max:

    0.000018 s

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN SILVER COPPER

PS2535L-1-F3-A Frequently Asked Questions (FAQs)

  • For optimal performance, it's recommended to follow the PCB layout guidelines provided in the datasheet, ensuring a solid ground plane, and using thermal vias to dissipate heat. Additionally, consider using a heat sink or thermal pad to reduce thermal resistance.
  • To ensure EMC and reduce EMI, follow the recommended PCB layout, use shielding, and implement filtering and decoupling techniques. Also, consider using a common-mode choke and ferrite beads to reduce emissions.
  • The recommended input capacitor is a 10uF ceramic capacitor with X7R or X5R dielectric, and the recommended output capacitor is a 22uF ceramic capacitor with X7R or X5R dielectric. However, the optimal capacitor values may vary depending on the specific application and operating conditions.
  • Implement overvoltage protection using a voltage supervisor or a dedicated overvoltage protection IC. For undervoltage protection, use a voltage supervisor or a power-on reset circuit to ensure the device operates within the recommended voltage range.
  • The thermal shutdown temperature is typically around 150°C, and the thermal hysteresis is around 10°C. However, these values may vary depending on the specific device and application, so it's essential to consult the datasheet and application notes for specific details.

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PS2535L-1-F3-A Overview

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