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PS2565L1-1-A - Renesas Electronics

Description: The PS2565-1 is optically coupled isolators containing GaAs light emitting diodes and an NPN silicon phototransistor. The PS2565-1 is in a plastic DIP (Dual In-line Package) and the PS2565L-1 is lead bending type (Gull-wing) for surface mount. The PS2565L1-1 is lead bending type for long creepage distance. The PS2565L2-1 is lead bending type for long creepage distance (Gull-wing) for surface mount.

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PS2565L1-1-A - Renesas Electronics - PCB symbol
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PS2565L1-1-A - Renesas Electronics PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 4-DIP-
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PS2565L1-1-A Details

  • Manufacturer Part Number:

    PS2565L1-1-A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIP-4

  • Country Of Origin:

    Japan

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    80%

  • Current Transfer Ratio-Nom:

    200%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.08 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    5000 V

  • JESD-609 Code:

    e1

  • Mounting Feature:

    THROUGH HOLE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.05 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    MAGAZINE

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000003 s

  • Surface Mount:

    NO

  • Terminal Finish:

    TIN SILVER COPPER

PS2565L1-1-A Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application notes (e.g., AN18411) and evaluation boards. It's essential to follow these guidelines to ensure proper thermal management, noise reduction, and signal integrity.
  • The PS2565L1-1-A has a thermal pad on the bottom, which requires a thermal interface material (TIM) and a heat sink for efficient heat dissipation. Ensure the PCB design allows for good airflow and consider using a thermal simulation tool to optimize the design.
  • The datasheet provides general guidelines, but Renesas recommends using a low-ESR capacitor (e.g., ceramic or polymer) with a value between 4.7 μF to 10 μF for CIN and a value between 10 μF to 22 μF for COUT. The specific values depend on the application's requirements and should be validated through simulation and testing.
  • Follow Renesas' EMC guidelines in their application notes and datasheet. Implement proper PCB layout, use shielding, and ensure good grounding. Additionally, consider using EMI filters and common-mode chokes to reduce emissions and improve immunity.
  • The PS2565L1-1-A requires a low-pass filter on the input (VIN) to reduce noise and ripple. A simple RC filter or a more complex filter like a π-filter can be used. For the output (VOUT), a low-pass filter or a capacitor can be used to reduce noise and improve stability.

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PS2565L1-1-A Overview

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