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PS2701A-1-F3-A - Renesas Electronics

Description: The PS2701A-1 is an optically coupled isolator containing a GaAs light emitting diode and an NPN silicon phototransistor to realize an excellent cost performance. This package is SOP (Small Outline Package) type and has shield effect to cut off ambient light. It is designed for high density mounting applications.

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PS2701A-1-F3-A Details

  • Manufacturer Part Number:

    PS2701A-1-F3-A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Japan, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.49.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    70 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.03 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    3750 V

  • JESD-609 Code:

    e6

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.03 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.000005 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

PS2701A-1-F3-A Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a metal shield or a shielded enclosure to reduce electromagnetic radiation. Ensure proper grounding and decoupling of the device. Follow the recommended PCB layout and component placement guidelines.
  • Power up the VCC pin first, followed by the VDD pin. Ensure that the VCC pin is stable before applying power to the VDD pin.
  • Use a heat sink or a thermal pad to dissipate heat. Ensure good airflow around the device. Avoid blocking the airflow around the device or the heat sink.
  • Use a reflow soldering process with a peak temperature of 240°C. Avoid using wave soldering or hand soldering. Follow the recommended soldering profile and temperature guidelines.

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PS2701A-1-F3-A Overview

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Part Image PS2701A-1-F3-A NEC Electronics America Inc

Transistor Output Optocoupler, 1-Element, 3750V Isolation, LEAD FREE, PLASTIC, SOP-4