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PS2733-1-F3-A - Renesas Electronics

Description: The PS2733-1 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon darlington-connected phototransistor. This package is SOP (Small Outline Package) type and has shield effect to cut off ambient light. It is designed for high density mounting applications.

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PS2733-1-F3-A - Renesas Electronics - PCB symbol
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PS2733-1-F3-A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - PS2733-1
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PS2733-1-F3-A - Renesas Electronics - 3D model - Small Outline Packages - PS2733-1
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PS2733-1-F3-A Details

  • Manufacturer Part Number:

    PS2733-1-F3-A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-4

  • Country Of Origin:

    Japan

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    350 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE AND RESISTOR

  • Current Transfer Ratio-Min:

    1500%

  • Current Transfer Ratio-Nom:

    4000%

  • Dark Current-Max:

    400 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    2500 V

  • JESD-609 Code:

    e6

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.15 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    DARLINGTON OUTPUT OPTOCOUPLER

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Power Dissipation-Max:

    0.15 W

  • Response Time-Max:

    0.0001 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

PS2733-1-F3-A Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a metal shield around the device, and ensure that the PCB layout and component placement minimize radiation. Follow the recommended layout and grounding guidelines to reduce EMI.
  • The PS2733-1-F3-A can operate from -40°C to 85°C, but the maximum junction temperature is 150°C. Ensure proper thermal management to prevent overheating.
  • Power up the device in the following sequence: VCC, AVCC, and then DVCC. Ensure that the power supplies are stable and within the recommended voltage range before applying the input signals.
  • Use 0.1 μF and 10 μF decoupling capacitors for VCC, AVCC, and DVCC. Place them as close to the device pins as possible, and ensure that the capacitors are connected to the corresponding power pins and ground.

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PS2733-1-F3-A Overview

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For a full list of alternate parts for PS2733-1-F3-A, check out Findchips.com