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PS2801C-1-A - Renesas Electronics

Description: These products are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon phototransistor in a plastic SSOP for high density applications to realize an excellent cost performance. This package has shield effect to cut off ambient light.

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PS2801C-1-A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 4-SOIC
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PS2801C-1-A Details

  • Manufacturer Part Number:

    PS2801C-1-A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-4

  • Country Of Origin:

    Japan, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.49.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    4

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    80 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    50%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.03 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    2500 V

  • JESD-609 Code:

    e6

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.03 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TAPE

  • Power Dissipation-Max:

    0.12 W

  • Response Time-Max:

    0.000005 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

PS2801C-1-A Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and electromagnetic interference (EMI).
  • Use a thermally conductive material for the PCB and ensure good thermal contact between the device and the PCB. Also, consider using a heat sink or thermal pad to dissipate heat effectively.
  • Monitor the input voltage, output voltage, and output current to ensure they are within the recommended operating ranges. Also, keep an eye on the device temperature and adjust the thermal design accordingly.
  • Implement external OVP and UVP circuits using zener diodes, resistors, and capacitors. The OVP circuit should trigger when the input voltage exceeds 18V, and the UVP circuit should trigger when the input voltage falls below 10V.
  • Use low-ESR ceramic capacitors (e.g., X5R or X7R) with a minimum capacitance of 10uF for the input and output. Ensure the capacitors are rated for the maximum operating voltage and temperature range.

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PS2801C-1-A Overview

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