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PS2811-1-V-F3-A - Renesas Electronics

Description: The PS2811-1 and PS2811-4 are optically coupled isolators containing a GaAs light emitting diode and an NPN silicon phototransistor in a plastic SSOP for high density applications. The package is a Shrink SOP (Small Outline Package) type for high density mounting applications.

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PS2811-1-V-F3-A - Renesas Electronics - PCB symbol
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PS2811-1-V-F3-A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 4-SOIC
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PS2811-1-V-F3-A - Renesas Electronics - 3D model - Small Outline Packages - 4-SOIC
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PS2811-1-V-F3-A Details

  • Manufacturer Part Number:

    PS2811-1-V-F3-A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-4

  • Country Of Origin:

    Japan, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.49.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • Additional Feature:

    UL APPROVED, VDE APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    40 V

  • Configuration:

    SINGLE

  • Current Transfer Ratio-Min:

    100%

  • Current Transfer Ratio-Nom:

    200%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    2500 V

  • JESD-609 Code:

    e6

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.04 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Power Dissipation-Max:

    0.12 W

  • Response Time-Max:

    0.000004 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

PS2811-1-V-F3-A Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a metal shield around the device, and ensure a good ground connection. Keep the PCB layout compact, and use a common mode choke or ferrite bead to filter out high-frequency noise.
  • Power up the device in the following sequence: VCC, AVCC, and then DVCC. Ensure that the power supplies are stable before applying the input signals.
  • Use a heat sink with a thermal conductivity of at least 1 W/m-K. Ensure good airflow around the device, and avoid blocking the airflow with nearby components.
  • Use a low-pass filter with a cutoff frequency of 10 kHz to 100 kHz to remove high-frequency noise. Ensure the input signal is within the recommended voltage range and has a suitable impedance matching.

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PS2811-1-V-F3-A Overview

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