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PS2815-1-A - Renesas Electronics

Description: The PS2815-1 and PS2815-4 are optically coupled isolators containing GaAs light emitting diodes and an NPN silicon phototransistor in a plastic SSOP for high density applications. The package is a Shrink SOP (Small Outline Package) type for high density mounting applications.

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PS2815-1-A - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - 4-SOIC
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PS2815-1-A - Renesas Electronics  - 3D model - Small Outline Packages - 4-SOIC
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PS2815-1-A Details

  • Manufacturer Part Number:

    PS2815-1-A

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SSOP-4

  • Country Of Origin:

    Japan, Taiwan

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Additional Feature:

    UL APPROVED

  • Coll-Emtr Bkdn Voltage-Min:

    40 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Current Transfer Ratio-Min:

    100%

  • Current Transfer Ratio-Nom:

    200%

  • Dark Current-Max:

    100 nA

  • Forward Current-Max:

    0.05 A

  • Forward Voltage-Max:

    1.4 V

  • Isolation Voltage-Max:

    2500 V

  • JESD-609 Code:

    e6

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Elements:

    1

  • On-State Current-Max:

    0.04 A

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -55 °C

  • Optoelectronic Device Type:

    AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER

  • Packing Method:

    TAPE

  • Power Dissipation-Max:

    0.12 W

  • Response Time-Max:

    0.000004 s

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Bismuth (Sn/Bi)

PS2815-1-A Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital sections separate, and use a common ground point for the analog and digital grounds.
  • Use a reliable communication protocol such as SPI or I2C, and ensure proper signal termination and noise filtering. Also, implement error detection and correction mechanisms to handle data transmission errors.
  • The device has a maximum junction temperature of 125°C. Ensure good airflow around the device, and consider using a heat sink or thermal pad to dissipate heat. Avoid overheating, as it can affect device reliability and lifespan.
  • Ensure that the power supply voltage (VCC) is stable and within the recommended range (2.7V to 3.6V). Use a low-dropout regulator (LDO) or a switching regulator to regulate the voltage. Power sequencing is critical; ensure that the power supply is stable before enabling the device.
  • The device has built-in ESD protection, but it's still important to follow proper ESD handling procedures during manufacturing and assembly. Use ESD-safe materials and equipment, and ensure that the device is properly grounded during handling and testing.

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PS2815-1-A Overview

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