PSK-10D-24 - CUI Inc.

PSK-10D-24 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout and thermal management for optimal performance?
  CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, ensure a minimum of 1 mm clearance around the module to allow for airflow.
• How do I ensure electromagnetic compatibility (EMC) with the PSK-10D-24?
  To ensure EMC, CUI recommends following proper PCB design and layout guidelines, using a metal enclosure, and implementing EMI filtering on the input and output lines. Additionally, the module should be installed in a way that minimizes radiation and conduction of electromagnetic interference.
• What is the derating curve for the PSK-10D-24 at high temperatures?
  CUI provides a derating curve in the datasheet, but for more detailed information, engineers can contact CUI's technical support team for a customized derating curve based on their specific application and environmental conditions.
• Can I use the PSK-10D-24 in a redundant or parallel configuration?
  Yes, the PSK-10D-24 can be used in a redundant or parallel configuration, but it's essential to follow CUI's guidelines for synchronization and current sharing to ensure reliable operation and prevent damage to the modules.
• What is the MTBF (Mean Time Between Failures) of the PSK-10D-24?
  CUI provides an MTBF rating of >1 million hours at 25°C, calculated according to MIL-HDBK-217F. However, the actual MTBF may vary depending on the application, environmental conditions, and quality of the PCB assembly.