CUI recommends a PCB layout with a solid ground plane and thermal vias to dissipate heat. A minimum of 2 oz copper thickness is recommended. Additionally, a thermal interface material (TIM) with a thermal conductivity of 1 W/m-K or higher is suggested to improve heat transfer between the device and the heat sink.
CUI recommends following the recommended soldering profile and using a solder with a melting point of 220°C or higher. Avoid applying excessive force or pressure during assembly, and ensure the device is handled by the edges to prevent damage to the pins or package.
CUI estimates a minimum lifespan of 10 years under normal operating conditions, with a failure rate of less than 1% per 1,000 hours. However, this may vary depending on the specific application, environmental conditions, and quality of the assembly process.
While the PSK-20D-12-T is designed to withstand normal operating conditions, it may not be suitable for high-vibration or high-shock environments. CUI recommends consulting with their application engineers to determine the suitability of the device for such environments and to discuss potential modifications or custom designs.
The PSK-20D-12-T is designed to meet CISPR 22 Class B emissions standards. To minimize electromagnetic interference, CUI recommends using a metal shield or enclosure, keeping the device away from sensitive components, and using proper grounding and shielding techniques.
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PSK-20D-12-T Overview
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