CUI recommends a PCB layout with a large copper area connected to the module's thermal pad to dissipate heat efficiently. A minimum of 1 oz copper thickness is recommended, and the copper area should be at least 1 inch x 1 inch in size.
CUI recommends using a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 180°C to 190°C. Apply a small amount of solder to the pad, and use a gentle touch to avoid damaging the component.
The PSK-20D-12 can tolerate a maximum voltage deviation of ±10% of the nominal input voltage. Exceeding this limit may affect the module's performance and reliability.
CUI recommends using overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the module. The OVP should be set to 12.6V maximum, and the UVP should be set to 10.8V minimum.
CUI recommends using a low-ESR capacitor with a value of 10uF to 22uF, and a voltage rating of 25V or higher. A ceramic or electrolytic capacitor with a low equivalent series resistance (ESR) is recommended.
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PSK-20D-12 Overview
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