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PSMN1R1-25YLC,115 - Nexperia

Description: N-Channel 25 V 100A (Tc) 215W (Tc) Surface Mount LFPAK56, Power-SO8

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PSMN1R1-25YLC,115 - Nexperia PCB footprint - Other - Other - PSMN1R1-25YLC,115-4
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PSMN1R1-25YLC,115 - Nexperia  - 3D model - Other - PSMN1R1-25YLC,115-4
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PSMN1R1-25YLC,115 Details

  • Manufacturer Part Number:

    PSMN1R1-25YLC,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SO8, LFPAK-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT669

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.3

  • Additional Feature:

    HIGH RELIABILITY, ULTRA LOW RESISTANCE

  • Avalanche Energy Rating (Eas):

    253 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.0015 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    406 pF

  • JEDEC-95 Code:

    MO-235

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    215 W

  • Pulsed Drain Current-Max (IDM):

    1318 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PSMN1R1-25YLC,115 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for PSMN1R1-25YLC,115 is a standard SOT23 package with a 1.3mm x 1.3mm pad size and a 0.5mm x 0.5mm thermal pad.
  • To ensure reliable operation of PSMN1R1-25YLC,115 in high-temperature environments, it is recommended to follow proper thermal design and layout guidelines, including providing adequate heat sinking and thermal relief.
  • The maximum allowed voltage on the gate of PSMN1R1-25YLC,115 is 20V, as specified in the datasheet. Exceeding this voltage may damage the device.
  • Yes, PSMN1R1-25YLC,115 can be used in switching applications, but it is essential to ensure that the device is operated within its specified ratings and that proper switching times and frequencies are maintained to avoid overheating and damage.
  • To calculate the power dissipation of PSMN1R1-25YLC,115, you need to consider the voltage and current ratings, as well as the thermal resistance of the device. You can use the datasheet specifications and thermal design guidelines to estimate the power dissipation.

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PSMN1R1-25YLC,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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