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PSMN2R0-25YLDX - Nexperia

Description: MOSFET PSMN2R0-25YLD/LFPAK/REEL 7" Q1

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PSMN2R0-25YLDX Details

  • Manufacturer Part Number:

    PSMN2R0-25YLDX

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP-8, 4 PIN

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT669

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.3

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    410 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    100 A

  • Drain-source On Resistance-Max:

    0.00291 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    152 pF

  • JEDEC-95 Code:

    MO-235

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    115 W

  • Pulsed Drain Current-Max (IDM):

    722 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PSMN2R0-25YLDX Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for PSMN2R0-25YLDX is a standard SOT23 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad of 2.5mm x 2.5mm.
  • To ensure the stability of the output voltage, it is recommended to use a minimum output capacitance of 1uF and a maximum ESR of 1 ohm, and to place the output capacitor as close to the device as possible.
  • The maximum ambient temperature range for PSMN2R0-25YLDX is -40°C to 150°C, but the device is only specified for operation up to 125°C.
  • Yes, PSMN2R0-25YLDX is suitable for high-reliability applications, but it is recommended to follow the guidelines for high-reliability design and manufacturing, and to perform thorough testing and validation.
  • To handle thermal management, it is recommended to provide a thermal pad on the PCB, use a heat sink if necessary, and ensure good airflow around the device.

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PSMN2R0-25YLDX Overview

Use the download button to access the PSMN2R0-25YLDX 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PSMN2, or try a keyword search, such as Power Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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