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PSMN2R3-100SSEJ - Nexperia

Description: N-channel 100 V, 2.3 mOhm MOSFET with enhanced SOA in LFPAK88

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PSMN2R3-100SSEJ - Nexperia - PCB symbol
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PCB Footprints
PSMN2R3-100SSEJ - Nexperia PCB footprint - Other - Other - SOT1235_2022-4
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PSMN2R3-100SSEJ - Nexperia - 3D model - Other - SOT1235_2022-4
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PSMN2R3-100SSEJ Details

  • Manufacturer Part Number:

    PSMN2R3-100SSEJ

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-1235, 4 PIN

  • Manufacturer Package Code:

    SOT1235

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    732 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    255 A

  • Drain-source On Resistance-Max:

    0.00228 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    94 pF

  • JESD-30 Code:

    R-PSSO-G4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    341 W

  • Pulsed Drain Current-Max (IDM):

    1020 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PSMN2R3-100SSEJ Frequently Asked Questions (FAQs)

  • The PSMN2R3-100SSEJ can operate safely between -55°C and 150°C, but the recommended operating temperature range is -40°C to 125°C.
  • Proper cooling can be achieved by using a heat sink with a thermal resistance of less than 10 K/W, and ensuring good airflow around the device. The thermal pad on the bottom of the package should be connected to a copper plane on the PCB for optimal heat dissipation.
  • A recommended PCB layout for the PSMN2R3-100SSEJ includes a solid copper plane for the thermal pad, a separate island for the drain pin, and a Kelvin connection for the source pin. The layout should also minimize parasitic inductance and ensure good decoupling.
  • Yes, the PSMN2R3-100SSEJ is suitable for high-reliability applications due to its rugged design, high-quality manufacturing process, and compliance with relevant industry standards such as AEC-Q101.
  • To handle the high peak current capability of the PSMN2R3-100SSEJ, ensure that the PCB traces and components can handle the maximum current, and consider using a current sense resistor to monitor the current. Also, ensure that the device is properly cooled to prevent overheating.

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PSMN2R3-100SSEJ Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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