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PSMN6R0-30YLB,115 - Nexperia

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PSMN6R0-30YLB,115 Details

  • Manufacturer Part Number:

    PSMN6R0-30YLB,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SO8, LFPAK-4

  • Pin Count:

    4

  • Manufacturer Package Code:

    SOT669

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.3

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    13 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    71 A

  • Drain-source On Resistance-Max:

    0.0081 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    78 pF

  • JEDEC-95 Code:

    MO-235

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    58 W

  • Pulsed Drain Current-Max (IDM):

    283 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PSMN6R0-30YLB,115 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for PSMN6R0-30YLB,115 is a DFN2020-6 (SOT1206) package with a minimum pad size of 1.3 mm x 1.3 mm and a maximum pad size of 1.5 mm x 1.5 mm.
  • To ensure reliable soldering, use a soldering temperature of 260°C (max) and a soldering time of 10 seconds (max). Also, use a solder with a melting point of 217°C (min) and a flux that is compatible with the device's package.
  • The maximum allowed voltage on the gate of PSMN6R0-30YLB,115 is 20 V. Exceeding this voltage may damage the device.
  • Yes, PSMN6R0-30YLB,115 is rated for operation up to 150°C (Tj). However, the device's performance and reliability may degrade at high temperatures, so it's essential to consider thermal management and derating when operating in high-temperature environments.
  • To prevent ESD damage, handle PSMN6R0-30YLB,115 with ESD-protective equipment, such as wrist straps, mats, and bags. Also, ensure that the device is stored in an ESD-protected environment when not in use.

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PSMN6R0-30YLB,115 Overview

Use the download button to access the PSMN6R0-30YLB,115 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like PSMN6, or try a keyword search, such as Power Field-Effect Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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