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PSMN9R0-25MLC,115 - Nexperia

Description: MOSFET PSMN9R0-25MLC/SOT1210/mLFPAK

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PCB Footprints
PSMN9R0-25MLC,115 - Nexperia PCB footprint - Other - Other - SOT1210 _2022
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3D Models
PSMN9R0-25MLC,115 - Nexperia  - 3D model - Other - SOT1210 _2022
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PSMN9R0-25MLC,115 Details

  • Manufacturer Part Number:

    PSMN9R0-25MLC,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LFPAK33-4

  • Pin Count:

    8

  • Manufacturer Package Code:

    SOT1210

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    8.7 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    55 A

  • Drain-source On Resistance-Max:

    0.0113 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    67 pF

  • JESD-30 Code:

    R-PSSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    45 W

  • Pulsed Drain Current-Max (IDM):

    219 A

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PSMN9R0-25MLC,115 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for PSMN9R0-25MLC,115 is a D2PAK (TO-263) package with a minimum pad size of 4.5mm x 3.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines, including providing adequate heat sinking, using thermal interface materials, and minimizing thermal resistance.
  • The maximum allowed voltage derating for PSMN9R0-25MLC,115 is typically 80% of the maximum rated voltage (25V) to ensure reliable operation and prevent premature failure.
  • While PSMN9R0-25MLC,115 is suitable for high-frequency switching applications, it's essential to consider the device's switching characteristics, including rise and fall times, and ensure that the application's switching frequency is within the device's recommended operating range.
  • To handle ESD protection when working with PSMN9R0-25MLC,115, follow proper ESD handling procedures, including using ESD-safe workstations, wrist straps, and packaging materials, and ensuring that the device is properly grounded during handling and assembly.

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PSMN9R0-25MLC,115 Overview

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About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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