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PTN3222GMJ - NXP

Description: Buffer, ReDriver 1 Channel 480Mbps 12-XQFN (1.75x2.2)

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Symbol
PTN3222GMJ - NXP - PCB symbol
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PCB Footprints
PTN3222GMJ - NXP PCB footprint - Other - Other - SOT2074-1 (XQFN12)
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3D Models
PTN3222GMJ - NXP - 3D model - Other - SOT2074-1 (XQFN12)
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PTN3222GMJ Details

  • Manufacturer Part Number:

    PTN3222GMJ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    XQFN-12

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • Additional Feature:

    IT CAN ALSO OPEARTE WITH 1.8V

  • Differential Output:

    NO

  • Driver Number of Bits:

    1

  • Input Characteristics:

    STANDARD

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    GENERAL PURPOSE

  • JESD-30 Code:

    R-PQCC-N12

  • Length:

    2.2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    XQCCN

  • Package Equivalence Code:

    LCC12,.07X.08,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, EXTREMELY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    3 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    0.5 mm

  • Supply Current-Max:

    55 mA

  • Supply Voltage-Max:

    3.63 V

  • Supply Voltage-Min:

    2.85 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    3 ns

  • Width:

    1.75 mm

PTN3222GMJ Frequently Asked Questions (FAQs)

  • A good PCB layout is crucial for the PTN3222GMJ. Ensure a solid ground plane, keep the input and output traces short and separate, and use a common mode choke to reduce EMI. Refer to NXP's application note AN11535 for more details.
  • Choose input capacitors with low ESR and high ripple current rating. For output capacitors, select ones with low ESR and high capacitance. A good starting point is 10uF for input and 22uF for output. Refer to the datasheet for more information on capacitor selection.
  • The PTN3222GMJ is rated for operation up to 85°C ambient temperature. However, for reliable operation, it's recommended to keep the ambient temperature below 70°C to ensure a safe margin.
  • Follow the recommended power-up and power-down sequences in the datasheet. Ensure a monotonic power-up and power-down ramp to prevent damage to the device. Use a soft-start circuit to limit inrush current during power-up.
  • Common failure modes include overheating, overvoltage, and overcurrent. Prevent these by ensuring proper thermal design, using overvoltage protection, and implementing overcurrent protection. Also, follow the recommended operating conditions and layout guidelines.

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PTN3222GMJ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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