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PTN3381BBS,518 - NXP

Description: Interface - Specialized ENHNCD PERFORMANCE HDMI/DVI SHFTR V-REG

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PCB Footprints
PTN3381BBS,518 - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - PTN3381BBS,518
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3D Models
PTN3381BBS,518 - NXP  - 3D model - Quad Flat No-Lead - PTN3381BBS,518
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PTN3381BBS,518 Details

  • Manufacturer Part Number:

    PTN3381BBS,518

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFN

  • Package Description:

    7 X 7 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT619-1, HVQFN48

  • Pin Count:

    48

  • Manufacturer Package Code:

    SOT619-1

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    52 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    S-PQCC-N48

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    48

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7 mm

PTN3381BBS,518 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output tracks as short as possible and use a common mode choke to reduce EMI.
  • Monitor the device's junction temperature, input voltage, and output current to ensure they are within the specified limits. Use thermal management techniques, such as heat sinks or thermal interfaces, to keep the junction temperature below 150°C.
  • Use a common mode choke and a differential mode filter to reduce EMI. Ensure the filter components are placed close to the device and the PCB layout is optimized for minimal radiation.
  • Use an oscilloscope to monitor the input and output waveforms, and check for signs of oscillation or ringing. Verify the PCB layout and component selection meet the recommended guidelines. Check for thermal issues, such as overheating or thermal runaway.
  • Yes, but ensure you follow NXP's guidelines for high-reliability and safety-critical applications. Implement redundant systems, error detection, and correction mechanisms to ensure the device operates within its specified limits.

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PTN3381BBS,518 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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