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PTN36043ABXY - NXP

Description: High Speed Basic USB Type-C Controller USB 3.1 1.8V T/R 18-Pin

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PTN36043ABXY - NXP - PCB symbol
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PCB Footprints
PTN36043ABXY - NXP PCB footprint - Other - Other - PTN36043ABXY-4
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3D Models
PTN36043ABXY - NXP - 3D model - Other - PTN36043ABXY-4
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PTN36043ABXY Details

  • Manufacturer Part Number:

    PTN36043ABXY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DHX2QFN-18

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    7

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • JESD-30 Code:

    R-PQCC-N18

  • Length:

    2.4 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    18

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC18,.07X.08,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.4 mm

  • Supply Voltage-Max (Vsup):

    1.9 V

  • Supply Voltage-Min (Vsup):

    1.7 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

PTN36043ABXY Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • Monitor input voltage, output voltage, current, and temperature. Implement over-voltage protection (OVP), under-voltage protection (UVP), and over-temperature protection (OTP).
  • Use a shielded enclosure, keep sensitive components away from the DC-DC converter, and use a common-mode choke to reduce EMI. Ensure proper grounding and decoupling.
  • Use a low-ESR ceramic capacitor (e.g., X5R or X7R) with a value between 10 μF to 22 μF, depending on the input voltage and frequency.

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PTN36043ABXY Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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PTN36043ABXY Alternates

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Part Image PTN36043ABX NXP Semiconductors

Consumer Circuit, PQCC18