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PUMD12,115 - Nexperia

Description: Pre-Biased Bipolar Transistor (BJT) 1 NPN, 1 PNP - Pre-Biased (Dual) 50V 100mA 230MHz, 180MHz 300mW Surface Mount 6-TSSOP

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Symbol
PUMD12,115 - Nexperia - PCB symbol
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PCB Footprints
PUMD12,115 - Nexperia PCB footprint - Other - Other - SOT363 ( SC-88)
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3D Models
PUMD12,115 - Nexperia - 3D model - Other - SOT363 ( SC-88)
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PUMD12,115 Details

  • Manufacturer Part Number:

    PUMD12,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-88, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    80

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PUMD12,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PUMD12,115 near a thermal pad or a heat sink, ensuring good thermal conductivity. Keep the component away from other heat sources and ensure good airflow around the device.
  • To ensure reliable operation in high-temperature environments, ensure the device is operated within the recommended temperature range (up to 150°C). Implement proper thermal management, such as heat sinks or thermal pads, and consider using a thermal interface material to improve heat transfer.
  • The recommended soldering conditions for the PUMD12,115 are: peak temperature 260°C, soldering time 10 seconds, and a temperature ramp-up rate of 3°C/s. Ensure the device is handled and stored in accordance with the JEDEC J-STD-020 standard.
  • Handle the PUMD12,115 by the body, avoiding touching the leads or electrical connections. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow the ESD precautions outlined in the JEDEC J-STD-033 standard.
  • Exceeding the maximum ratings for the PUMD12,115 can lead to reduced reliability, permanent damage, or even device failure. Ensure the device operates within the recommended voltage, current, and temperature ranges to prevent damage and ensure reliable operation.

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PUMD12,115 Overview

Use the download button to access the PUMD12,115 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PUMD1, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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