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PUMD9,115 - Nexperia

Description: Transistor NPN/PNP 50V 10K 47K SOT363 NXP, PUMD9,115 NPN+PNP Digital Transistor, 100 mA 50 V 10 kΩ, Ratio Of 0.21, 6-Pin UMT

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Symbol
PUMD9,115 - Nexperia - PCB symbol
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PCB Footprints
PUMD9,115 - Nexperia PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT363
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3D Models
PUMD9,115 - Nexperia - 3D model - SOT23 (6-Pin) - SOT363
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PUMD9,115 Details

  • Manufacturer Part Number:

    PUMD9,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-88, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT-IN BIAS RESISTOR RATIO IS 4.7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-60134

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PUMD9,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PUMD9,115 near a thermal pad or a heat sink, ensuring good thermal conductivity. Keep the component away from other heat sources and ensure good airflow around the device.
  • To ensure reliable operation in high-temperature environments, ensure the device is operated within the recommended temperature range (up to 150°C). Implement proper thermal management, such as heat sinks or thermal pads, and consider using a thermal interface material to improve heat transfer.
  • The recommended soldering conditions for the PUMD9,115 are: peak temperature 260°C, soldering time 10 seconds, and a soldering iron temperature of 350°C. Ensure the device is handled and stored in accordance with the JEDEC J-STD-020 standard.
  • Handle the PUMD9,115 by the body, avoiding touching the leads or electrical connections. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and follow the JEDEC J-STD-033 standard for handling and storage.
  • The electrical characteristics of the PUMD9,115, such as voltage and current ratings, may vary under different operating conditions (e.g., temperature, humidity). Consult the datasheet and application notes for specific information, and consider consulting with a Nexperia representative for customized support.

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PUMD9,115 Overview

Use the download button to access the PUMD9,115 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PUMD9, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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