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PUMH18,115 - Nexperia

Description: Pre-Biased Bipolar Transistor (BJT) 2 NPN - Pre-Biased (Dual) 50V 100mA 300mW Surface Mount 6-TSSOP

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PUMH18,115 - Nexperia - PCB symbol
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PCB Footprints
PUMH18,115 - Nexperia PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT363 (SC-88)--
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3D Models
PUMH18,115 - Nexperia - 3D model - SOT23 (6-Pin) - SOT363 (SC-88)--
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PUMH18,115 Details

  • Manufacturer Part Number:

    PUMH18,115

  • Brand Name:

    Nexperia

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    SC-88, 6 PIN

  • Pin Count:

    6

  • Manufacturer Package Code:

    SOT363

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Date Of Intro:

    2017-02-01

  • Manufacturer:

    Nexperia

  • YTEOL:

    7

  • Additional Feature:

    BUILT IN BIAS RESISTOR RATIO 2.1

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN RESISTOR

  • DC Current Gain-Min (hFE):

    50

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

PUMH18,115 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the PUMH18,115 near a thermal pad or a heat sink, ensuring good thermal conductivity. The layout should also minimize thermal resistance by using thick copper tracks and avoiding thermal bottlenecks.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The recommended soldering conditions for the PUMH18,115 involve using a soldering iron with a temperature of 250°C to 270°C, and a soldering time of 3 to 5 seconds. It's also essential to use a solder with a melting point above 217°C to ensure reliable joints.
  • To protect the PUMH18,115 from electrical overstress (EOS), it's essential to follow proper handling and storage procedures, such as avoiding electrostatic discharge (ESD) and using antistatic packaging. Additionally, consider using voltage clamping devices or transient voltage suppressors to limit voltage spikes.
  • The recommended storage conditions for the PUMH18,115 involve storing the devices in their original packaging, away from direct sunlight, moisture, and extreme temperatures. The storage temperature should be between -40°C and 125°C, and the relative humidity should be below 60%.

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PUMH18,115 Overview

Use the download button to access the PUMH18,115 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like PUMH1, or try a keyword search, such as Small Signal Bipolar Transistors

About Nexperia

Nexperia is a leading global player in the semiconductor industry. Specializing in essential electronic components, Nexperia offers a diverse range of products including discrete components, MOSFETs, logic ICs, and analog ICs. These components are integral to a multitude of applications across automotive, industrial, consumer electronics, and computing sectors, where reliability, performance, and efficiency are paramount.

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