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Q2006L4 - LITTELFUSE

Description: Triacs 200V 6A 25-25-25mA

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Symbol
Q2006L4 - LITTELFUSE - PCB symbol
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PCB Footprints
Q2006L4 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB (L-Package) *
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3D Models
Q2006L4 - LITTELFUSE - 3D model - Transistor Outline, Vertical - TO-220AB (L-Package) *
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Q2006L4 Details

  • Manufacturer Part Number:

    Q2006L4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Commutation Voltage-Min:

    4 V/us

  • Critical Rate of Rise of Off-State Voltage-Min:

    120 V/us

  • DC Gate Trigger Current-Max:

    25 mA

  • DC Gate Trigger Voltage-Max:

    2.5 V

  • Holding Current-Max:

    50 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.05 mA

  • Moisture Sensitivity Level:

    2

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    6 A

  • Reference Standard:

    UL RECOGNIZED

  • Repetitive Peak Off-state Voltage:

    200 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Trigger Device Type:

    4 QUADRANT LOGIC LEVEL TRIAC

Q2006L4 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the device and connect it to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can help reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It is also crucial to ensure good airflow and avoid thermal hotspots.
  • When paralleling multiple Q2006L4 devices, it is essential to ensure that each device has its own current sense resistor and that the devices are matched for current sharing. Additionally, consider the impact of mismatched devices on overall system performance and reliability.
  • To troubleshoot issues with the Q2006L4, start by reviewing the system design and ensuring that the device is used within its recommended operating conditions. Check for proper PCB layout, thermal management, and component selection. Use oscilloscopes and current probes to monitor the device's behavior and identify potential issues. Consult the datasheet and application notes for guidance on troubleshooting specific faults.
  • When using the Q2006L4 in a high-reliability or safety-critical application, it is essential to follow the recommended design and testing guidelines. Ensure that the device is used within its recommended operating conditions, and consider implementing redundant or fault-tolerant designs to mitigate the risk of device failure. Additionally, consult with Littelfuse Inc or a qualified reliability engineer to ensure that the device meets the required safety and reliability standards.

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Q2006L4 Overview

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