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Q4008LTTP - LITTELFUSE

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Q4008LTTP - LITTELFUSE  - 3D model
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Q4008LTTP Details

  • Manufacturer Part Number:

    Q4008LTTP

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TO-220AB

  • Package Description:

    ROHS COMPLIANT, PLASTIC, ISOLATED TO-220AB, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE WITH BUILT-IN TRIGGER ELEMENT IN SERIES WITH GATE

  • Critical Rate of Rise of Commutation Voltage-Min:

    4 V/us

  • Critical Rate of Rise of Off-State Voltage-Min:

    120 V/us

  • Holding Current-Max:

    60 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    2 mA

  • Moisture Sensitivity Level:

    2

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    8 A

  • Repetitive Peak Off-state Voltage:

    400 V

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    TRIAC WITH INT TRIGGER

Q4008LTTP Frequently Asked Questions (FAQs)

  • Littelfuse recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
  • Littelfuse recommends using a soldering iron with a temperature of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. The component should be soldered within 3 seconds to 5 seconds, and the solder joints should be inspected for proper wetting and filleting.
  • The Q4008LTTP can withstand surge currents up to 200 A for 10 ms, and up to 100 A for 100 ms, according to the IEC 61000-4-5 standard.
  • Yes, the Q4008LTTP can be used in high-frequency applications up to 100 kHz. However, the device's impedance and insertion loss should be considered in the design, and the user should consult the datasheet for specific characteristics.
  • Yes, the Q4008LTTP is compatible with lead-free soldering processes, and it meets the requirements of the RoHS directive.

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Q4008LTTP Overview

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