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Q4010R5 - LITTELFUSE

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Q4010R5 - LITTELFUSE  - 3D model
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Q4010R5 Details

  • Manufacturer Part Number:

    Q4010R5

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220AB

  • Package Description:

    TO-220, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.30.00.80

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Case Connection:

    MAIN TERMINAL 2

  • Configuration:

    SINGLE

  • Critical Rate of Rise of Commutation Voltage-Min:

    4 V/us

  • Critical Rate of Rise of Off-State Voltage-Min:

    200 V/us

  • DC Gate Trigger Current-Max:

    50 mA

  • DC Gate Trigger Voltage-Max:

    2.5 V

  • Holding Current-Max:

    50 mA

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Leakage Current-Max:

    0.5 mA

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -65 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RMS On-state Current-Max:

    10 A

  • Repetitive Peak Off-state Voltage:

    400 V

  • Surface Mount:

    NO

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Trigger Device Type:

    4 QUADRANT LOGIC LEVEL TRIAC

Q4010R5 Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a thermal pad on the bottom of the device and connect it to a large copper area on the PCB. This helps to dissipate heat efficiently. Additionally, keeping the PCB traces and vias away from the thermal pad can help reduce thermal resistance.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. It is also crucial to ensure good airflow and avoid thermal hotspots.
  • When paralleling multiple Q4010R5 devices, it is essential to ensure that each device has an identical thermal environment and is connected in a way that minimizes current imbalance. This can be achieved by using a common heat sink, identical PCB layouts, and careful selection of components. Additionally, consider using a current-sharing technique, such as active current balancing, to ensure equal current distribution.
  • To protect the Q4010R5 from EOS and ESD, it is recommended to follow proper handling and storage procedures. Use anti-static packaging and wrist straps when handling the devices. In the circuit design, consider adding transient voltage suppressors (TVS) or surge protectors to absorb voltage spikes and protect the device from EOS. Additionally, use ESD protection devices, such as diodes or resistors, to prevent ESD damage.
  • When using the Q4010R5 in a high-reliability or safety-critical application, it is essential to follow a rigorous design and testing process. Consider using redundant or fault-tolerant designs, and ensure that the device is operated within its recommended specifications. Additionally, perform thorough testing and validation, including environmental and reliability testing, to ensure the device meets the required standards.

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Q4010R5 Overview

Use the download button to access the Q4010R5 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like Q4010, or try a keyword search, such as TRIACs

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