QEB363 - onsemi

QEB363 Frequently Asked Questions (FAQs)

• What is the recommended PCB layout for optimal thermal performance?
  A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to an internal copper plane or a heat sink.
• How do I ensure reliable operation at high temperatures?
  The QEB363 is rated for operation up to 150°C. To ensure reliable operation at high temperatures, it's essential to follow proper PCB design and layout guidelines, use a suitable thermal interface material, and provide adequate heat sinking. Additionally, consider derating the device's power dissipation and voltage ratings according to the onsemi application note.
• What is the recommended input capacitor value and type for the QEB363?
  A low-ESR ceramic capacitor with a value of 10uF to 22uF is recommended for input decoupling. The capacitor should be placed as close as possible to the VIN pin and have a voltage rating of at least 25V. X5R or X7R dielectric types are suitable for this application.
• How do I optimize the QEB363 for low standby power consumption?
  To minimize standby power consumption, ensure that the EN pin is properly biased to a logic low level when the device is not in use. Additionally, consider using a low-power mode or shutdown feature if available in your system design. Proper PCB design and component selection can also help reduce standby power consumption.
• What is the maximum allowed voltage on the EN pin?
  The EN pin is a logic input and should not exceed the maximum rating of 6V. Voltages above 6V can cause damage to the internal circuitry. If a higher voltage is required, consider using a voltage divider or a level-shifting circuit to ensure the EN pin remains within the recommended voltage range.