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QH8MA4TCR - ROHM Semiconductor

Description: 30V Nch+Pch Middle Power MOSFET

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Symbol
QH8MA4TCR - ROHM Semiconductor - PCB symbol
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PCB Footprints
QH8MA4TCR - ROHM Semiconductor PCB footprint - Other - Other - TSMT8-2022
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3D Models
QH8MA4TCR - ROHM Semiconductor - 3D model - Other - TSMT8-2022
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QH8MA4TCR Details

  • Manufacturer Part Number:

    QH8MA4TCR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.4

  • Avalanche Energy Rating (Eas):

    3.5 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain-source On Resistance-Max:

    0.016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    18 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

QH8MA4TCR Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Implement proper thermal management, and consider using a heat sink or thermal interface material if necessary.
  • Follow the JEDEC J-STD-020D.1 standard for lead-free soldering. The recommended peak temperature is 260°C, with a maximum time above 217°C of 60 seconds.
  • Use an ESD wrist strap or mat, and ensure all equipment is grounded. Handle the component by the body, not the leads. Use anti-static packaging and follow proper ESD handling procedures.
  • Store the component in a dry, cool place, away from direct sunlight. The recommended storage temperature range is -40°C to 35°C, with a relative humidity of 60% or less.

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QH8MA4TCR Overview

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